Design of CNC System for Wire Bending Robot Based on GTS Motion Controller

为了解决三维复杂金属线材和弹簧类零件的快速制造与生产问题,设计了一台具有X、z两个移动轴和y、A、b三个回转轴的五自由度弯丝机器人。采用PC+运动控制卡的开放式数控结构完成了系统硬件平台的搭建,利用MfC与控制卡提供的动态链接库完成了数控系统软件的编写,实现了系统的绝大部分功能,并应用于课题组设计的弯丝机器人系统中。In order to solve rapid manufacturing and processing problem of workpieces with 3D complex surface and springs w hich w ere made of metal w ire or such other materials,a five degreed of freedom CNC w ire bending robot w hich had X,Z tw o parallel movement axes and Y,A,B three rotary movement axes w as designed.The system hardw are platform w as build through an open-architecture NC system based on IPC and motion control card,the softw are w as programmed by Microsoft Foundation Class and the dynamic link library w hich provide by Googol GTS card that achieved mostly system functions.The CNC system has been used to the w ire bending robot w hich designed by research team.国家科技重大专项(2010ZX04001-162

Comparison between the Electroless Copper Plating Processes Using Sodiu m Hypophosphite and For maldehyde as Reductants

比较并评价了以甲醛和以次磷酸钠为还原剂的化学镀铜工艺。结果表明,次磷酸钠镀铜液的稳定性高于甲醛镀铜液,次磷酸钠镀液的沉积速率高于甲醛镀液。以甲醛为还原剂的镀层晶粒细小,而以次磷酸钠为还原剂的镀层呈团粒状。甲醛镀铜层铜的质量分数接近100%,次磷酸钠镀铜层中铜的质量分数为93.9%,镍的质量分数为6.1%,镀层为铜-镍合金。以甲醛为还原剂的化学镀铜层的电导率、抗拉强度、延伸率等物理性能均优于次磷酸钠化学镀铜层。The processes of the electroless copper plating using sodium hypophosphite and formaldehyde as reductants were compared and evaluated.The results show that the electrolyte using sodium hypophosphite as reducing agent is more stable than that using formaldehyde as reducing agent;the electroless deposition rate of the sodium hypophosphite solution is higher than that of the formaldehyde bath;the deposit grains are very fine and dense when using formaldehyde as reductant,and the other is of agglomerate morphology;the copper content in formaldehyde's deposit is nearly 100%(wt),and the deposit from sodium hypophosphite bath contains 93.9%(wt) copper and 6.1%(wt) nickel;the conductirity,tensile strength and ductibility of formaldehyde's deposit are better than that from the sodium hypophosphite solution.国家科技攻关计划资助项目(2004BA325C

The Size and Shape Effects on the Optical Properties of Gold Nanoparticles

【中文文摘】纳米尺度的金属及半导体呈现出特殊的光学、电学及磁学性质,采用近年发展起来的离散偶极近似(DDA)的方法,我们分析了金纳米粒子的尺寸及形状对其光学性质的影响。粒子周围介质的影响在文中亦作了分析。计算结果显示,金纳米粒子的等离子体吸收带同时受到粒子尺寸和形状的影响,但来自形状的影响更为明显。与米氏理论及扩展的甘氏理论相比较,DDA方法在粒子尺寸不再远小于入射光波长的时候更准确,并能应用于任何形状的纳米粒子。理论计算与实验结果能较好的吻合。 【英文文摘】Metals and semiconductors exhibit unusual optical, electronic, and magnetic properties at the nanometer scale. Based on the newly developed method, discrete dipole approximation (DDA), the dependence of the optical properties of the gold nanoparticles on the size and shape was analyzed. The effects of the surrounding medium were also taken into consideration in the calculation. The calculated results show that the plasmon absorption band depends on both the size and shape of the gold noanoparticles. However , the influence of the shape is more significant . Compared to the Mieps theory and the extension , Gansp theory , the DDA method is more accurate when the dimensions of the particles are not much smaller than the wavelength of the incident light and can be applied to particles of any shape. The theoretical results are in good agreement with the experimental data.国家自然科学基金项目,批准号为 :20003008,2983306

社会系统工程与国家治理体系现代化

2014年3月30日,中国人民大学国家发展与战略研究院社会系统工程研究中心成立暨“社会系统工程与国家治理体系现代化“学术研讨会在中国人民大学逸夫会堂第一会议室举行,来自十余所高校和学术团体的专家、学者和一些媒体的代表参加了会议。现把会议主要发言内容选载如下

量子密钥分配网络分析

量子密钥分配（QKD）网络是由网络节点按照一定的拓扑结构连接而成的。目前出现的QKD网络可根据其节点功能性分为3类:光学节点QKD网络、信任节点QKD网络以及量子节点QKD网络。文章论述了QKD网络的研究进展,对现有的3种网络的结构、性能进行了全面的对比分析。通过对比,提出了一种高效实用的新型QKD网络方案

Study on the Threshold of Vegetation Coverage in Arid Area

通过对已有的关于植被覆盖度的概念进行分析比较,提出几个新的植被建设覆盖度阈值生态允许覆盖度、生态要求覆盖度和经济允许覆盖度,并给出了它们的计算方法。尤为重要的是,提出了当经济与生态发生矛盾时,最佳覆盖度在不同情况下分别取生态最优解和经济最优解。当生态允许覆盖度小于生态要求覆盖度时,最佳覆盖度为生态允许覆盖度;当生态要求覆盖度大于经济允许覆盖度时,最佳覆盖度为经济最优解;当生态要求覆盖度小于经济允许覆盖度时,最佳覆盖度为生态最优解。最后给出了生态最优解和经济最优解的计算方法

Research of 2,2′-dipyridine on Electroless Copper Plating Using Sodium Hypophosphite as Reductant

通讯作者, Tel: (86-592) 2181436, E-ma il: fzyang@ xmu. edu. cn[中文文摘]研究了以次磷酸钠作还原剂的化学镀铜体系,添加剂2,2′-联吡啶对化学镀铜沉积速率、次磷酸钠阳极氧化和铜离子阴极还原、以及镀层形貌、结构和组分存在状态的影响.结果表明,2,2′-联吡啶对化学沉积起阻化作用.电化学线性伏安扫描实验显示,镀液中加入2,2′-联吡啶,次磷酸钠的氧化峰电势有所负移,但峰电流减小;铜离子的还原峰电势负移,但峰电流逐渐增大.扫描电子显微镜(SEM)、能量色散谱(EDS)、X射线衍射(XRD)及X射线光电子能谱(XPS)等实验分别表明,添加剂使镀层致密和光亮、镍含量降低;镀层为Cu-Ni合金,呈面心立方结构,无明显晶面择优取向现象;镀层中铜和镍以金属态存在,磷的质量含量小于0.05%.[英文文摘]In the bath of the electroless copper plating using sodium hypophosphite as reductant,the effects of 2,2′-dipyridine on the deposition rate,anodic oxidation of sodium hypophosphite,cathodic reduction of copper ions,surface morphologies,structure and the existing status of the deposit components were examined.The results showed that,2,2′-dipyridine hindered the electroless deposition.Experiments of liner sweep voltammetry(LSV) indicated that,as the addition of 2,2′-dipyridine to the electrolyte,the oxidation peak potentia l of sod-ium hypophosph ite shifted to amore negative value but the peak current decreased; the reduc ing peak po tentia l of copper ions moved to a more negative value whereas the peak current increased. Scanning electron microscope (SEM )、energy dispersive spectroscopy (EDS)、X-ray diffraction (XRD) and X-ray photoe lectron spectroscopic (XPS) experiments displayed tha,t the additive caused the deposit in the compacter, brighter and lower nickel content. the deposit was Cu-N i alloy in face-cen tered cubic structure without obvious crysta l face preferred orientation.the copper and nickel in the deposit were in metal state, and the weight content of phosphorus was less than 0. 05% .国家科技攻关计划项目(2004BA325C)项目资