基于硅微加工工艺的微热板传热分析

針對常壓和真空兩種環境 ,通過三維有限元模擬分析了背面體硅加工型、正面體硅加工型和表面加工型三種微熱板 (MHP)的傳熱主渠道和加熱功率 .制作了背面體硅加工型和表面加工型MHP ,并對兩者在常壓及 13 3Pa氣壓下的加熱功率進行了測試 .實驗值與有限元分析結果一致 ,表明雖然真空中表面加工型MHP熱功耗小于背面體硅加工型MHP ,但薄層空氣導熱使表面加工型MHP在大氣中的功耗大幅增加 ,并大于背面體硅加工型MHP的熱功耗 .Thermal simulation of three types of MHPs (surface micro-machined, back-side bulk silicon micro-machined, and front-side bulk silicon micro-machined) working in atmosphere and vacuum is performed with 3D FEA. Their first two types of MHPs are fabricated and their experimental results are in agreement with the FEA. It is shown that, power consumption of the surface micromachined MHP is smaller than the back-side bulk silicon micromachined MHP in vacuum; however, in atmosphere, thermal conduction of the thin air layer in the surface micro-machined MHP dramatically increases its power consumption, with is much larger than that of the back-side bulk silicon micromachined MHP