45 research outputs found
배추와 무의 속간교배체에서의 배유 유래 교배 장벽에 관한 연구
학위논문 (석사)-- 서울대학교 대학원 : 농업생명과학대학 식물생산과학부(원예과학전공), 2019. 2. 허진회.Interspecific or intergeneric hybridization is vital to the evolution of flowering plants. However, interspecific or intergeneric hybridization often faces in hybridization barriers, resulting in seed abortion or sterility of F1 hybrids. In angiosperms, failure of endosperm development is one of the major causes of immediate hybridization barrier. To date, dysregulation of imprinted genes in developing endosperm has been proposed to be explain the endosperm-derived hybridization barrier. A general mechanism of hybridization barrier remains to be demonstrated. xBrassicoraphanus is an intergeneric hybrid of Chinese cabbage (Brassica rapa L.) and radish (Raphanus sativus L.). Newly synthesized xBrassicoraphanus F1 hybrids often display seed abortion accompanied with embryo arrest and underdeveloped endosperm. Here I report that intergeneric F1 hybrid between B. rapa and R. sativus showed endosperm-derived hybridization barrier. RNA-seq was conducted on intergeneric endosperm to identify imprinted genes related to hybridization barriers. Unexpectedly, the most of transcripts from intergeneric endosperm were maternal reads originated from B. rapa. Moreover, SCAR marker analysis revealed that intergeneric hybrid endosperm largely consisted of maternal genome derived from B. rapa. Therefore, these results suggested the possibility that the hybridization barrier in intergeneric F1 hybrids of B. rapa and R. sativus may be involved in the inhibition of fertilization between the central cell and sperm. These results provide further insights into the post-zygotic hybridization barrier between distantly related species in the Brassicaceae family.지구상의 많은 식물들은 종간이나 속간 교잡을 통하여 많은 종으로 분화가 되어 왔다. 일반적으로 교배 전 장벽 (Prezygotic hybridization barrier)과 교배 후 장벽 (Postzygotic hybridization barrier)에 의해 새로운 식물체를 얻는 것은 매우 힘들다고 알려져 있다. 특히 교배 후 장벽은 접합자 형성 이후 잡종의 발달과정이나 불임 등으로 생식적 격리가 일어나는 것을 말한다. 속간이질사배체 식물인 배무채 (xBrassicoraphanus)는 배추 (Brassica rapa L.)와 무 (Raphanus sativus L.) 사이에서 성공적으로 교잡되었다. 하지만, 배배양 (embryo rescue)을 통해서만 새롭게 배무채를 교잡할 수 있고, 이는 배유의 비정상적인 발달이 관련되어 있음을 시사한다. 본 연구에서는 배추와 무 사이의 이속간 교배에 있어서 배유 유래 교배 장벽을 연구하였다. 초기 배추와 무의 교잡 종자의 발달과정 관찰을 통해서 정상적인 배의 발달에 비해, 배유는 정상적으로 발달하지 못함을 확인하였다. 배유 유래 교배 장벽에 있어서 유전자 각인 현상이 관여한다는 최근 연구를 토대로 교잡 종자 배유의 전사체 분석을 하였다. 그 결과 모계의 전사체만을 확인하였다. 또한 SCAR 마커를 이용하여 교잡 종자의 배유에는 모계 유전체만이 존재함을 확인하였다. 정세포 (sperm)가 중심세포 (central cell)와는 수정되지 않고 난세포 (egg cell)와만 수정이 되어도 일시적인 배유 발달이 진행된다고 알려져 있다. 이와 비슷하게 배추와 무의 교잡 종자에서 수정된 배에 의해 일시적으로 미수정된 배유가 발달하는 현상을 보이고, 이후에는 정상적인 종자 발달을 하지 못하는 것으로 생각된다. 따라서 배추와 무의 이속간 교배에서는 배유의 미수정에 따른 교배장벽이 존재하는 것으로 추정된다.CONTENTS
ABSTRACT ···························································· i
CONTENTS ··························································· iii
LIST OF TABLES ····················································· v
LIST OF FIGURES ··················································· vi
LIST OF ABBREVIATIONS ······································ viii
INTRODUCTION ···················································· 1
LITERATURE REVIEWS ········································· 4
1. Hybridization barrier
2. Seed development
3. Autonomous endosperm
MATERIAL AND METHODS ···································11
Plant materials
Light microscopy
RNA extraction for RNA-seq
SNP calling
Identification of imprinted genes
DNA extraction and SCAR marker analysis
RESULTS ·····························································16
Phenotypic analysis of intergeneric hybrid seeds
Embryo and endosperm development in intergeneric hybrids
Identification of imprinted loci in endosperm and embryo
Double fertilization is disrupted by intergeneric hybridization barrier
DISCUSSION·························································31
REFERENCES ······················································35
ABSTRACT IN KOREAN ········································44Maste
Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging
We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices
방사형 자기장 내의 전기도금된 평면코일을 이용한 전자기형 마이크로 액추에이터
This paper presents an electromagnetic microactuator using the copper coil electroplated on the p+silicon diaphragm. The microactuator generates a vertical motion of the diaphragm using the radial direction, we propose a new actuator structure with twin magnets. The microactuator field in the radial direction, we propose a new actuator structure with twin magnets. The microactator shows a values of resonant frequency and quality factor in the ranges of 10.51±0.22kHz and 46.6±3.3, respectively. The twin magnet microactuator generates the maximum peak-to-peak amplitude of 4.4μm for the AC rms current of 26.8mA, showing 2.4 times larger amplitude than the single magnet microactuator
Design Parameters and Experimental Performance Evaluation of 4-bit Digital Multi-heater Microinjector
We present the design, fabrication and experimental results of 4-bit digital microinjectors, whose ejected droplet volumes are adjusted by the digital operation of a 4-bit microheater array. We design the reference microinjectors as well as its comparative test structures. In the fabrication process, we use a five-mask micromachining process and the total chip size of the fabricated microinjector is We measure the ejected droplet volumes and velocities, which are adjusted from respectively, depending on the 15 possible combinations of 4-bit microheater array. We also experimentally characterize the effect of geometric variation including the microheater size, inter-microheater gap, microchannel width and sequential operation of microheater array on the ejected droplet volume and velocity. Among these parameters, we find that the microheater size is the most dominant parameter affected to the ejected droplet volumes and velocities. Thus, the present microinjector has a potential for application to the high-resolution inkjet printers with multiple gray levels or high-precision fluid injectors with variable volume control
Measurement of Glass-Silicon Interfacial Feature Toughness and Experimental Evaluation of Anodic Bonding Process based on the Taguchi Method
Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460 with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites
Micro fluid injector and its injection method
본 발명은 미소량의 유체를 분사하는 미소유체분사기 및 그 분사방법에 있어서, 한 유체의 팽창 혹은 기화에 의해 발생하는 압력을 이용하여 미소량의 다른 유체를 분사하는 미소유체분사기 및 그 분사방법을 제공하는 데 그 목적이 있다.본 발명에 따르면, 유체를 분사하는 유체분사기에 있어서, 팽창유체저장부에 저장된 팽창유체(60)가 후단을 통해 공급되며 선단이 개방된 수평유로(20)와, 수평유로(20)의 선단부에 연통되며 분사유채저장부로부터 분사유체(70)가 공급되는 적어도 한 개이상의 분사유체공급유로(30) 및, 수평유로(20)와 분사유체공급유로(30)가 연통되는 지점 후방에 위치한 수평유로(20)에 설치된 가열부(40)를 포함하며, 수평유로(20)의 후단으로부터 공급된 팽창유체(60)는 가열부(40)를 지나 수평유로(20)와 분사유체공급유로(30)의 연통된 지점에 머물러서 분사유체공급유로(30)를 통해 공급된 분사유체(70)와 계면을 형성하게 구성된 유체분사기가 제공된다.양호하게는 팽창유체(60)와 분사유체(70)의 계면 사이에는 공기막(50)이 형성된다
