Interchip Via Technology for Vertical System Integration

Vertical System Integration(r) means the realization of three-dimensional integrated systems by thinning, stacking and vertical interchip wiring of completely processed and electrically tested device substrates. The Interchip via (ICV) technology is introduced and discussed as a fully CMOS-compatible wafer-scale process, which provides vertical electrical interchip interconnects placed at arbitrary locations without intervention to the IC's fabrication technologies. Thinning of the device substrate (150 mm) down to 10 mu m as well as bonding it to an other silicon wafer had basically no influence on the electrical performance of EEPROM-products and process monitor structures. Resistances of 2 Ohm for a 2 x 2 mu m2 interchip via contact and working contact chains with 480 interchip via contacts are promising results for the future fabrication of multi-layered three-dimensional systems combining the advantages of different device technologies

High-throughput proteomics reveal alarmins as amplifiers of tissue pathology and inflammation after spinal cord injury.

Spinal cord injury is characterized by acute cellular and axonal damage followed by aggressive inflammation and pathological tissue remodelling. The biological mediators underlying these processes are still largely unknown. Here we apply an innovative proteomics approach targeting the enriched extracellular proteome after spinal cord injury for the first time. Proteomics revealed multiple matrix proteins not previously associated with injured spinal tissue, including small proteoglycans involved in cell-matrix adhesion and collagen fibrillogenesis. Network analysis of transcriptomics and proteomics datasets uncovered persistent overexpression of extracellular alarmins that can trigger inflammation via pattern recognition receptors. In mechanistic experiments, inhibition of toll-like receptor-4 (TLR4) and the receptor for advanced glycation end-products (RAGE) revealed the involvement of alarmins in inflammatory gene expression, which was found to be dominated by IL1 and NFκΒ signalling. Extracellular high-mobility group box-1 (HMGB1) was identified as the likely endogenous regulator of IL1 expression after injury. These data reveal a novel tissue remodelling signature and identify endogenous alarmins as amplifiers of the inflammatory response that promotes tissue pathology and impedes neuronal repair after spinal cord injury

High-throughput proteomics reveal alarmins as amplifiers of tissue pathology and inflammation after spinal cord injury.

Spinal cord injury is characterized by acute cellular and axonal damage followed by aggressive inflammation and pathological tissue remodelling. The biological mediators underlying these processes are still largely unknown. Here we apply an innovative proteomics approach targeting the enriched extracellular proteome after spinal cord injury for the first time. Proteomics revealed multiple matrix proteins not previously associated with injured spinal tissue, including small proteoglycans involved in cell-matrix adhesion and collagen fibrillogenesis. Network analysis of transcriptomics and proteomics datasets uncovered persistent overexpression of extracellular alarmins that can trigger inflammation via pattern recognition receptors. In mechanistic experiments, inhibition of toll-like receptor-4 (TLR4) and the receptor for advanced glycation end-products (RAGE) revealed the involvement of alarmins in inflammatory gene expression, which was found to be dominated by IL1 and NFκΒ signalling. Extracellular high-mobility group box-1 (HMGB1) was identified as the likely endogenous regulator of IL1 expression after injury. These data reveal a novel tissue remodelling signature and identify endogenous alarmins as amplifiers of the inflammatory response that promotes tissue pathology and impedes neuronal repair after spinal cord injury