21 research outputs found
Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder
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New approach to effective diffusion coefficient evaluation in the nanostructured two-phase media
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Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
No full textGrowth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
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Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C
No full textEffect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates
No full text10.1007/s11664-009-0925-xJournal of Electronic Materials38122479-2488JECM
