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1 research outputs found
Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
Author
ABB Research
Alent Alpha and Fico Besi
+63 more
Alpha Metals
Alpha Metals
Alpha Metals
Alpha Metals and Setna Rohan
Applied Nanoparticle Laboratory and Toyota Motor
Applied Nanoparticle Laboratory Chip Nihon Superior
Baker Hughes Inc.
Boschman
Danfoss Power Solutins
Freescale Semiconductor Inc.
Henkel
Henkel
Henkel
Henkel
Heraeus
Heraeus
Heraeus
Heraeus
Heraeus Deutschland
Hitachi
Hitachi Chem.
Hitachi Chem.
Hitachi Ltd.
Indium Corp.
Infineon Tech
Infineon Tech
Infineon Tech
Infineon Tech
Infineon Tech
Infineon Tech
Infineon Tech
Infineon Tech.
Int Rectifier
Int Rectifier
Ixys
Ixys
Ixys
K. S. Siow
Kaken Tech
Locatelli Meccanica
Namics
Nichia
Nichia
Nichia
Robert Bosch
Robert Bosch
Samsung Electro Mech.
Samsung Electro Mech.
Semikron Electrinic
Semikron Electronics
Siemens
Siemens
Siemens AG
Tanaka Kikinzoku
Tanaka Kikinzoku
Texas Instruments Inc.
Toyoda Gosei Co.
Toyota
Valeo Electronique
Valtion Teknillinen
Virginia Tech Intell Prop
Virginia Tech Intell Prop
Y. T. Lin
Publication venue
'ASME International'
Publication date
Field of study
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