Ballistic electron emission microscopy spectroscopy study of AlSb and InAs/AlSb superlattice barriers

Due to its large band gap, AlSb is often used as a barrier in antimonide heterostructure devices. However, its transport characteristics are not totally clear. We have employed ballistic electron emission microscopy (BEEM) to directly probe AlSb barriers as well as more complicated structures such as selectively doped n-type InAs/AlSb superlattices. The aforementioned structures were grown by molecular beam epitaxy on GaSb substrates. A 100 Å InAs or 50 Å GaSb capping layer was used to prevent surface oxidation from ex situ processing. Different substrate and capping layer combinations were explored to suppress background current and maximize transport of BEEM current. The samples were finished with a sputter deposited 100 Å metal layer so that the final BEEM structure was of the form of a metal/capping layer/semiconductor. Of note is that we have found that hole current contributed significantly to BEEM noise due to type II band alignment in the antimonide system. BEEM data revealed that the electron barrier height of Al/AlSb centered around 1.17 eV, which was attributed to transport through the conduction band minimum near the AlSb X point. Variation in the BEEM threshold indicated unevenness at the Al/AlSb interface. The metal on semiconductor barrier height was too low for the superlattice to allow consistent probing by BEEM spectroscopy. However, the superlattice BEEM signal was elevated above the background noise after repeated stressing of the metal surface. A BEEM threshold of 0.8 eV was observed for the Au/24 Å period superlattice system after the stress treatment

Effect of cylindrical geometry on the wet thermal oxidation of AlAs

We have investigated the wet thermal oxidation of AlAs in cylindrical geometry, a typical configuration for vertical-cavity surface-emitting lasers. Through both experiment and theoretical calculations, we demonstrate a significantly different time dependence for circular mesas from what has been reported in the literature both in studies of stripes and in a study of circular mesas. We attribute this different time dependence to the effect of geometry on the oxidation

Strain in wet thermally oxidized square and circular mesas

In this paper, we report the observation, through optical microscopy, of drumhead-like patterns in square and circular mesas which have been wet thermally oxidized to completion. Micro-Raman spectroscopy measurements are used to show that these patterns roughly correspond to variations in strain induced in surrounding semiconductor layers by the oxidation process. In addition, the patterns have a specific orientation with respect to the crystallographic axes of the semiconductor. A crystallographic dependence of the oxidation process itself is demonstrated and used to explain the orientation of the drumhead patterns

Near infrared avalanche photodiodes with bulk Al0.04Ga0.96Sb and GaSb/AlSb superlattice gain layers

We demonstrate the use of bulk Al0.04Ga0.96Sb and GaSb/AlSb superlattice as the gain material in a separate absorption/multiplication avalanche photodiode with sensitivity up to 1.74 µm. Both gain schemes were implemented in a molecular-beam epitaxy grown structure with a selectively doped InAs/AlSb superlattice as the n-type layer. Hole impact ionization enhancement was observed in Al0.04Ga0.96Sb by using a two wavelength injection scheme. The superlattice gain layer device exhibited multiplication factors in excess of 300, and surface limited dark current at a level comparable to InGaAs/InAlAs devices of similar design. The superlattice gain layer was found to be more promising than its bulk counterpart due to its inherent lower dark current

General Conditions for Lepton Flavour Violation at Tree- and 1-Loop Level

In this work, we compile the necessary and sufficient conditions a theory has to fulfill in order to ensure general lepton flavour conservation, in the spirit of the Glashow-Weinberg criteria for the absence of flavour-changing neutral currents. At tree-level, interactions involving electrically neutral and doubly charged bosons are investigated. We also investigate flavour changes at 1-loop level. In all cases we find that the essential theoretical requirements can be reduced to a few basic conditions on the particle content and the coupling matrices. For 1-loop diagrams, we also investigate how exactly a GIM-suppression can occur that will strongly reduce the rates of lepton flavour violating effects even if they are in principle present in a certain theory. In all chapters, we apply our criteria to several models which can in general induce lepton flavour violation, e.g. LR-symmetric models or the MSSM. In the end we give a summarizing table of the obtained results, thereby demonstrating the applicability of our criteria to a large class of models beyond the Standard Model.Comment: 31 pages, 2 figure

Physical modelling of amorphous thermoplastic polymer and numerical simulation of micro hot embossing process

Micro hot embossing process is considered as one of the most promising micro replication processes for manufacturing of polymeric components, especially for the high aspect ratio components and large surface structural components. A large number of hot embossing experimental results have been published, the material modelling and processes simulation to improve the quality of micro replication by hot embossing process are still lacking. This paper consists to 3D modelling of micro hot embossing process with amorphous thermoplastic polymers, including the mechanical characterisation of polymers properties, identification of the viscoelastic behaviour law of the polymers, numerical simulation and experimental investigation of micro hot embossing process. Static compression creep tests have been carried out to investigate the selected polymers’ viscoelastic properties. The Generalized Maxwell model has been proposed to describe the relaxation modulus of the polymers and good agreement has been observed. The numerical simulation of the hot embossing process in 3D has been achieved by taking into account the viscoelastic behaviour of the polymers. The microfluidic devices with the thickness of 2 mm have been elaborated by hot embossing process. The hot embossing process has been carried out using horizontal injection/compression moulding equipment, especially developed for this study. A complete compression mould tool, equipped with the heating system, the cooling system, the ejection system and the vacuum system, has been designed and elaborated in our research. Polymer-based microfluidic devices have been successfully replicated by the hot embossing process using the compression system developed. Proper agreement between the numerical simulation and the experimental elaboration has been observed. It shows strong possibility for the development of the 3D numerical model to optimize the micro hot embossing process in the future