A Room-Temperature High-Conductivity Metal Printing Paradigm with Visible-Light Projection Lithography

Fabricating electronic devices require integrating metallic conductors and polymeric insulators in complex structures. Current metal-patterning methods such as evaporation and laser sintering require vacuum, multistep processes, and high temperature during sintering or postannealing to achieve desirable electrical conductivity, which damages low-temperature polymer substrates. Here reports a facile ecofriendly room-temperature metal printing paradigm using visible-light projection lithography. With a particle-free reactive silver ink, photoinduced redox reaction occurs to form metallic silver within designed illuminated regions through a digital mask on substrate with insignificant temperature change (<4 °C). The patterns exhibit remarkably high conductivity achievable at room temperature (2.4 × 107 S m−1, ≈40% of bulk silver conductivity) after simple room-temperature chemical annealing for 1–2 s. The finest silver trace produced reaches 15 µm. Neither extra thermal energy input nor physical mask is required for the entire fabrication process. Metal patterns were printed on various substrates, including polyethylene terephthalate, polydimethylsiloxane, polyimide, Scotch tape, print paper, Si wafer, glass coverslip, and polystyrene. By changing inks, this paradigm can be extended to print various metals and metal–polymer hybrid structures. This method greatly simplifies the metal-patterning process and expands printability and substrate materials, showing huge potential in fabricating microelectronics with one system

Controlled Synthesis of Carbon-Encapsulated Copper Nanostructures by Using Smectite Clays as Nanotemplates

Rhomboidal and spherical metallic-copper nanostructures were encapsulated within well-formed graphitic shells by using a simple chemical method that involved the catalytic decomposition of acetylene over a copper catalyst that was supported on different smectite clays surfaces by ion-exchange. These metallic-copper nanostructures could be separated from the inorganic support and remained stable for months. The choice of the clay support influenced both the shape and the size of the synthesized Cu nanostructures. The synthesized materials and the supported catalysts from which they were produced were studied in detail by TEM and SEM, powder X-ray diffraction, thermal analysis, as well as by Raman and X-ray photoelectron spectroscopy.

Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation

This paper describes the ultrasound assisted dispersal of a low wt./vol.% copper nanopowder mixture and determines the optimum conditions for de-agglomeration. A commercially available powder was added to propan-2-ol and dispersed using a magnetic stirrer, a high frequency 850 kHz ultrasonic cell, a standard 40 kHz bath and a 20 kHz ultrasonic probe. The particle size of the powder was characterized using dynamic light scattering (DLS). Z-Average diameters (mean cluster size based on the intensity of scattered light) and intensity, volume and number size distributions were monitored as a function of time and energy input. Low frequency ultrasound was found to be more effective than high frequency ultrasound at de-agglomerating the powder and dispersion with a 20 kHz ultrasonic probe was found to be very effective at breaking apart large agglomerates containing weakly bound clusters of nanoparticles. In general, the breakage of nanoclusters was found to be a factor of ultrasonic intensity, the higher the intensity the greater the de-agglomeration and typically micron sized clusters were reduced to sub 100 nm particles in less than 30 min using optimum conditions. However, there came a point at which the forces generated by ultrasonic cavitation were either insufficient to overcome the cohesive bonds between smaller aggregates or at very high intensities decoupling between the tip and solution occurred. Absorption spectroscopy indicated a copper core structure with a thin oxide shell and the catalytic performance of this dispersion was demonstrated by drop coating onto substrates and subsequent electroless copper metallization. This relatively inexpensive catalytic suspension has the potential to replace precious metal based colloids used in electronics manufacturing

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed

Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors

Air-stable, surface-oxide free Cu nanoparticles are, for the first time, synthesized by surrounding completely the Cu surface with oleic acid incorporated as a capping molecule. XPS analysis, in conjunction with TEM analysis, revealed that the oleic acid is chemisorbed to the Cu surface via a chemical interaction wherein a monodentate bond is included, without leaving behind free (non-interacting) oleic acid, thereby providing complete surface protection against oxidation. By eliminating the surface oxide layer that critically degrades the electrical properties, the surface-oxide free Cu nanoparticle ink facilitates the realization of a solution-processed Cu electrode layer with resistivity as low as 4 mu Omega cm, comparable to the resistivity of noble metal-based, solution-processed counterparts. In addition, high resolution Cu electrode patterns with 5 mu m line-width are directly printed using an electrohydrodynamic inkjet technique, and graphene transistors with the printed Cu electrodes demonstrate potential applications in printed electronics.close14

Laser printing of silver-based micro-wires in ZrO2 substrate for smart implant applications

Smart implants are endowed with functions of sensing, actuating and control to solve problems that may arise during their use. The assembly of these functions along the implant surface is still a challenge. However, with the advent of 3D printing, it is possible to print on implants’ surface, communication channels or micro-antennas or even sensoric/actuating areas. Hence, a positive impact on the long-term performance of the implants (including hip, dental and knee) may be expected with the proposed approach. Despite titanium and Ti6Al4V titanium alloy are the standard choice for implants fabrication, 3Y-TZP (tetragonal 3% mol yttria-stabilized zirconia) has emerged as a ceramic material suitable to overcome titanium alloy problems, due to its numerous advantages. In this sense, this work is concerned with the ability of printing silver-based communication system in zirconia substrates by using laser technology. For this purpose, micro-cavities were created on ZrO2 substrate, where the silver powder was placed and sintered into them. Through the laser approach, silver-based wires with great quality and low resistivity values were achieved. The flexural strength results showed that the mechanical resistance of zirconia disks was affected by laser micro-wire printing, which decreased as the laser passage was performed. Based on the results, it is believed that the proposed approach seems to be effective for the manufacturing of implants with intrinsic capacities, useful for smart implant applications.This work has been supported by FCT (Fundação para a Ciência e Tecnologia - Portugal) in the scope of the projects UID/EEA/04436/ 2019 and NORTE-01-0145-FEDER-000018-HAMaBICo and Add.Additive_Manufacturing to Portuguese Industry_POCI-01-0247- FEDER-024533. Thank the CNPq (205791/2014-0) and CAPES for the financial support

Observation of Coalescence Process of Silver Nanospheres During Shape Transformation to Nanoprisms

In this report, we observed the growth mechanism and the shape transformation from spherical nanoparticles (diameter ~6 nm) to triangular nanoprisms (bisector length ~100 nm). We used a simple direct chemical reduction method and provided evidences for the growth of silver nanoprisms via a coalescence process. Unlike previous reports, our method does not rely upon light, heat, or strong oxidant for the shape transformation. This transformation could be launched by fine-tuning the pH value of the silver colloidal solution. Based on our extensive examination using transmission electron microscopy, we propose a non-point initiated growth mechanism, which is a combination of coalescence and dissolution–recrystallization process during the growth of silver nanoprisms