Photoresist patterned thick-film piezoelectric elements on silicon

A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 ?m and a film thickness of 100 ?m. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN?1

A Critique of the Use of the Balanced Scorecard in Multi-Enterprise Family Farm Businesses

Business strategy is very important to small and medium family businesses as many are both fragile and vulnerable; strategy provides a solid foundation for survival. Various studies have identified that businesses that engage in strategic management outperform those that do not. Despite this knowledge the uptake of many aspects of strategic management by farm businesses has been slow. Although the development of business plans is now common there is often a disconnect between monitoring and strategy. The Balanced Scorecard (BSC) was applied to case study farms during both the planning process and as they implemented and controlled their strategic choices to determine areas of difference that restrict or enhance it as a management tool for both family and farming businesses. The BSC was immediately applicable in the strategic management process for those businesses with current business plans. It could be used to test the degree of balance between the goals already identified in their plans. It was able to be used to critique the control measures they had in place and to determine how well they could be used to derive the causal chain from the operational level to family goals. In some instances either outcome or driver measures were recognized as being missing, in others the wiring within the balanced scorecard revealed some strategic measures without linkages.Farm Management,

High density p-type Bi0.5Sb1.5Te3 nanowires by electrochemical templating through ion-track lithography

High density p-type Bi0.5Sb1.5Te3 nanowire arrays are produced by a combination of electrodeposition and ion-track lithography technology. Initially, the electrodeposition of p-type wBi(0.5)Sb(1.5)Te(3) films is investigated to find out the optimal conditions for the deposition of nanowires. Polyimide-based Kapton foils are chosen as a polymer for ion track irradiation and nanotemplating Bi0.5Sb1.5Te3 nanowires. The obtained nanowires have average diameters of 80 nm and lengths of 20 mu m, which are equivalent to the pore size and thickness of Kapton foils. The nanowires exhibit a preferential orientation along the {110} plane with a composition of 11.26 at.% Bi, 26.23 at.% Sb, and 62.51 at.% Te. Temperature dependence studies of the electrical resistance show the semiconducting nature of the nanowires with a negative temperature coefficient of resistance and band gap energy of 0.089 +/- 0.006 eV

Molecular models for the core components of the flagellar type-III secretion complex

We show that by using a combination of computational methods, consistent three-dimensional molecular models can be proposed for the core proteins of the type-III secretion system. We employed a variety of approaches to reconcile disparate, and sometimes inconsistent, data sources into a coherent picture that for most of the proteins indicated a unique solution to the constraints. The range of difficulty spanned from the trivial (FliQ) to the difficult (FlhA and FliP). The uncertainties encountered with FlhA were largely the result of the greater number of helix packing possibilities allowed in a large protein, however, for FliP, there remains an uncertainty in how to reconcile the large displacement predicted between its two main helical hairpins and their ability to sit together happily across the bacterial membrane. As there is still no high resolution structural information on any of these proteins, we hope our predicted models may be of some use in aiding the interpretation of electron microscope images and in rationalising mutation data and experiments

Improving the dielectric and piezoelectric properties of screen-printed low temperature PZT/polymer composite using cold isostatic pressing

This paper reports an improvement in dielectric and piezoelectric properties of screen-printed PZT/polymer films for flexible electronics applications using Cold Isostatic Pressing (CIP). The investigation involved half and fully cured PZT/polymer composite pastes with weight ratio of 12:1 to investigate the effect of the CIP process on the piezoelectric and dielectric properties. It was observed that the highest dielectric and piezoelectric properties are achieved at pressures of 5 and 10 MPa for half and fully cured films respectively. The relative dielectric constants were 300 and 245 measured at 1 kHz for the half and fully cured samples. Using unoptimised poling conditions, the initial d33 values were 30 and 35 pC/N for the half and fully cured films, respectively. The fully cured sample was then poled using optimized conditions and demonstrated a d33 of approximately 44 pC/N which is an increase of 7% compared with non-CIP processed material

Metallic Triple Beam Resonator with Thick-film Printed Drive and Pickup

A triple beam resonator fabricated in 430S17 stainless steel with thick-film piezoelectric elements to drive and detect the vibrations is presented. The resonator substrate was fabricated by a simultaneous, double-sided photochemical etching technique and the thick-film piezoelectric elements were deposited by a standard screen-printing process. The combination of these two batch-fabrication processes provides the opportunity for mass production of the device at low cost. The resonator, a dynamically balanced triple beam tuning fork (TBTF) structure 23.5 mm long and 6.5 mm wide, has a favoured mode at 4.96 kHz with a Q-factor of 3630 operating in air

Verification of shrinkage curvature code prediction models

An attempt is made to theoretically and experimentally verify the shrinkage curvature models presented in Eurocode 2 and BS 8110. These codes claim that the models originally derived and proven for uncracked sections are suitable, with modification, for predicting the behaviour of cracked sections, although this claim has never been proven experimentally. To achieve verification, an alternative theoretical approach is initially proposed in this paper. In this theoretical model, the effect of shrinkage, creep and the variation in the neutral axis position of the section are taken into account. The stresses developed in the steel and concrete at a cracked section according to this theoretical model are then applied to a finite-element (FE) model representing a portion of the beam from the crack to mid-way between the crack and an adjacent crack. Ultimately, the mean curvature is determined. Experimentally, pairs of beams were cast and subjected to a level of flexural loading to produce a stabilised crack pattern in the constant-moment zone. The behaviour of the beams was monitored for up to 180 days. For any pair of beams, one beam was cast using a high-shrinkage concrete and the other with a low-shrinkage concrete. Each concrete type, however, exhibits similar creep. Therefore, shrinkage curvature can be obtained by subtracting the long-term movements of one beam from the other. These experimentally defined curvatures were compared with the mean curvatures obtained from the FE analysis. The comparison showed reasonable agreement. The curvatures were also compared with uncracked and cracked curvatures predicted by the codes. The curvatures derived in this investigation fell within the boundaries of the uncracked and cracked curvatures predicted by the codes and, for the fully cracked case, the curvatures were closer to the uncracked boundary

Microelectromechanical systems vibration powered electromagnetic generator for wireless sensor applications

This paper presents a silicon microgenerator, fabricated using standard silicon micromachining techniques, which converts external ambient vibrations into electrical energy. Power is generated by an electromagnetic transduction mechanism with static magnets positioned on either side of a moving coil, which is located on a silicon structure designed to resonate laterally in the plane of the chip. The volume of this device is approximately 100 mm3. ANSYS finite element analysis (FEA) has been used to determine the optimum geometry for the microgenerator. Electromagnetic FEA simulations using Ansoft’s Maxwell 3D software have been performed to determine the voltage generated from a single beam generator design. The predicted voltage levels of 0.7–4.15 V can be generated for a two-pole arrangement by tuning the damping factor to achieve maximum displacement for a given input excitation. Experimental results from the microgenerator demonstrate a maximum power output of 104 nW for 0.4g (g=9.81 m s1) input acceleration at 1.615 kHz. Other frequencies can be achieved by employing different geometries or material