A Critical Review of Recent Progress on Negative Capacitance Field-Effect Transistors

The elegant simplicity of the device concept and the urgent need for a new "transistor" at the twilight of Moore's law have inspired many researchers in industry and academia to explore the physics and technology of negative capacitance field effect transistor (NC-FET). Although hundreds of papers have been published, the validity of quasi-static NC and the frequency-reliability limits of NC-FET are still being debated. The concept of NC - if conclusively demonstrated - will have broad impacts on device physics and technology development. Here, the authors provide a critical review of recent progress on NC-FETs research and some starting points for a coherent discussion.Comment: 19 pages, 2 figure

1D van der Waals Material Tellurium: Raman Spectroscopy under Strain and Magneto-transport

Experimental demonstrations of 1D van der Waals material tellurium have been presented by Raman spectroscopy under strain and magneto-transport. Raman spectroscopy measurements have been performed under strains along different principle axes. Pronounced strain response along c-axis is observed due to the strong intra-chain covalent bonds, while no strain response is obtained along a-axis due to the weak inter-chain van der Waals interaction. Magneto-transport results further verify its anisotropic property, resulting in dramatically distinct magneto-resistance behaviors in terms of three different magnetic field directions. Specifically, phase coherence length extracted from weak antilocalization effect, L$_{\Phi}$ ~ T$^{-0.5}$, claims its 2D transport characteristics when an applied magnetic field is perpendicular to the thin film. In contrast, L$_{\Phi}$ ~ T$^{-0.33}$ is obtained from universal conductance fluctuations once the magnetic field is along c-axis of Te, indicating its nature of 1D transport along the helical atomic chains. Our studies, which are obtained on high quality single crystal tellurium thin film, appear to serve as strong evidences of its 1D van der Waals structure from experimental perspectives. It is the aim of this paper to address this special concept that differs from the previous well-studied 1D nanowires or 2D van der Waals materials

III-V and 2D Devices: from MOSFETs to Steep-Slope Transistors

With silicon CMOS technology approaching the scaling limit, alternating channel materials and novel device structures have been extensively studied and attracted a lot of attention in solid-state device research. In this dissertation, solid-state electron devices for post-Si CMOS applications are explored including both new materials such as III-V and 2D materials and new device structures such as tunneling field-effect transistors and negative capacitance field-effect transistors. Multiple critical challenges in applying such new materials and new device structures are addressed and the key achievements in this dissertation are summarized as follows: 1) Development of fabrication process technology for ultra-scaled planar and 3D InGaAs MOSFETs. 2) Interface passivation by forming gas anneal on InGaAs gate-all-around MOSFETs. 3) Characterization methods for ultra-scaled MOSFETs, including a correction to subthreshold method and low frequency noise characterization in short channel devices. 4) Development of short channel InGaAs planar and 3D gate-allaround tunneling field-effect transistors. 5) Negative capacitance field-effect transistors with hysteresis-free and bi-directional sub-thermionic subthreshold slope and the integration with various channel materials such as InGaAs and MoS2

Steep-slope Hysteresis-free Negative Capacitance MoS2 Transistors

The so-called Boltzmann Tyranny defines the fundamental thermionic limit of the subthreshold slope (SS) of a metal-oxide-semiconductor field-effect transistor (MOSFET) at 60 mV/dec at room temperature and, therefore, precludes the lowering of the supply voltage and the overall power consumption. Adding a ferroelectric negative capacitor to the gate stack of a MOSFET may offer a promising solution to bypassing this fundamental barrier. Meanwhile, two-dimensional (2D) semiconductors, such as atomically thin transition metal dichalcogenides (TMDs) due to their low dielectric constant, and ease of integration in a junctionless transistor topology, offer enhanced electrostatic control of the channel. Here, we combine these two advantages and demonstrate for the first time a molybdenum disulfide (MoS2) 2D steep slope transistor with a ferroelectric hafnium zirconium oxide layer (HZO) in the gate dielectric stack. This device exhibits excellent performance in both on- and off-states, with maximum drain current of 510 {\mu}A/{\mu}m, sub-thermionic subthreshold slope and is essentially hysteresis-free. Negative differential resistance (NDR) was observed at room temperature in the MoS2 negative capacitance field-effect-transistors (NC-FETs) as the result of negative capacitance due to the negative drain-induced-barrier-lowering (DIBL). High on-current induced self-heating effect was also observed and studied.Comment: 23 pages, 14 figure

β\beta-Ga2_2O3_3 Nano-membrane Negative Capacitance Field-effect Transistor with Steep Subthreshold Slope for Wide Bandgap Logic Applications

Steep-slope $\beta$-Ga$_2$O$_3$ nano-membrane negative capacitance field-effect transistors (NC-FETs) are demonstrated with ferroelectric hafnium zirconium oxide in gate dielectric stack. Subthreshold slope less than 60 mV/dec at room temperature is obtained for both forward and reverse gate voltage sweeps with a minimum value of 34.3 mV/dec at reverse gate voltage sweep and 53.1 mV/dec at forward gate voltage sweep at $V_{DS}$=0.5 V. Enhancement-mode operation with threshold voltage ~0.4 V is achieved by tuning the thickness of $\beta$-Ga$_2$O$_3$ membrane. Low hysteresis of less than 0.1 V is obtained. The steep-slope, low hysteresis and enhancement-mode $\beta$-Ga$_2$O$_3$ NC-FETs are promising as nFET candidate for future wide bandgap CMOS logic applications.Comment: 21 pages, 5 figure

Switching Mechanism in Single-Layer Molybdenum Disulfide Transistors: an Insight into Current Flow across Schottky Barriers

In this article, we study the properties of metal contacts to single-layer molybdenum disulfide (MoS2) crystals, revealing the nature of switching mechanism in MoS2 transistors. On investigating transistor behavior as contact length changes, we find that the contact resistivity for metal/MoS2 junctions is defined by contact area instead of contact width. The minimum gate dependent transfer length is ~0.63 {\mu}m in the on-state for metal (Ti) contacted single-layer MoS2. These results reveal that MoS2 transistors are Schottky barrier transistors, where the on/off states are switched by the tuning the Schottky barriers at contacts. The effective barrier heights for source and drain barriers are primarily controlled by gate and drain biases, respectively. We discuss the drain induced barrier narrowing effect for short channel devices, which may reduce the influence of large contact resistance for MoS2 Schottky barrier transistors at the channel length scaling limit.Comment: ACS Nano, ASAP (2013