556 research outputs found

    Enhancement of liner materials based on nanomaterials to promote sustainability in noise intercourse

    Get PDF
    Daily usage of devices has had a major influence on lives and existence, which would be unimaginable without them. Due to this, recent gadget dependability concerns need particular attention. PCs, hand mobile phones, and other computerized household gadgets need integrated circuits (ICs). Individual components must work together to accomplish their tasks and make the circuit operate. Hot carrier effect, oxide breakdown, and other system-level problems result from accommodating several devices in a planar IC. Vertical linking active components in one IC to another IC is a common method of three-dimensional IC integration (3D-IC). The main issue with 3D-IC adoption is electrical interference to neighboring through silicon via (TSV) and active transistors, which substantially reduces system performance. The electrical TSV (ETSV) model, which employs solely electrical signal carrying TSV, and the thermal TSV (TTSV) model, which incorporates thermal TSV during simulation, are used in this research to reduce electrical interference. The electrical signal transporting TSV to the substrate and other TSV was investigated for interference. With other models, this study also shows higher frequency regimes up to 1 THz. We found that the suggested methodology improves 3D-IC development by more than 30% by reducing electrical interference from signal-carrying TSV to other TSV

    Noise coupling reduction using temperature enhanced device for future integrated circuit integration applications

    Get PDF
    Information technology-to-internet of things may have succeeded because of fast silicon chip capability expansion. Moore's law, which reduces device size, boosted integrated circuit (IC) performance. Delay rises with highdensity connection parasitic capacitance. Interconnect delays have surpassed transistor delays and slowed progress. An alternative is required now to reduce connection latency. The third dimension is used in popular 3D IC technology IC technology requires through silicon via (TSV) for signal integrity and heat mitigation. Noise coupling hinders electrical communication between signal-carrying TSVs (aggressive TSVs) and ground TSVs (victim TSVs), a 3D IC bottleneck. TSVs must be dielectrically insulated from Si substrates to avoid electrical signal interference. Additionally, first-order modelling will confirm the suggestions. This article proposes using the nanosheet field effect transistor (NSFET) to overcome 3D IC noise coupling and complementary metal oxide semiconductor (CMOS) technology nodes. After discussing the electronic industry and sub nm, several basic metrics and criteria for developing electronic components are presented. The first technique uses Perylene-N's exceptional noise-cancelling characteristics. Second technique uses electrical TSV (ETSV), thermal TSV (TTSV), and heat source models to measure noise coupling on numerous ICs. The third proposes many noise-reducing materials. The suggested structures outperform traditional approaches

    Vasoplegic syndrome after off pump coronary artery bypass grafting surgery

    Get PDF
    We report a case of 48-years-old man who developed nor-epinephrine resistant vasoplegic syndrome after elective off pump coronary artery bypass grafting surgery. The failure of norepinephrine to improve the patients’ hemodynamics promted us to start treatment with vasopressin. Within an hour, the hemodynamics begin to improve. After 4 hours, patient was stable enough to be weaned from vasopressin, extubated at the end of 24 hrs and shifted to ward at the end of 48 hours. Vasoplegic syndrome can occur commonly after cardiopulmonary bypass and incidence can go up to 10%. This case was reported to insist upon the fact that vasoplegic syndrome can occur even after off pump surgeries. Herein we discuss the aetiology, risk factors, pathophysiology and prophylactic measures to be taken, for the prevention of vasoplegic syndrome

    Idiopathic multilocular thymic cyst-an incidental anterior mediastinal mass

    Get PDF
    Acquired thymic cyst are multilocular and they occur de novo or in association with mediastinal neoplasm, systemic autoimmune diseases and trauma. Here, we report a case of acquired multilocular thymic cyst due to non-specific inflammatory etiology in a 42-year old gentleman and our approach to diagnosis and management of anterior mediastinal mass. With no specific clinical symptom, he was diagnosed with anterior mediastinal mass incidentally by imaging studies. Definitive diagnosis of multilocular thymic cyst was obtained by tissue diagnosis of the anterior mediastinal mass resected during the surgery

    Antimicrobial activity study of ethanolic extract of Alternanthera sessilis linn. aerial parts

    Get PDF
    The ethanolic extract of Alternanthera sessilis Linn. was evaluated for antimicrobial activity study against medically important gram-positive bacteria such as Staphylococcus aureus, Bacillus subtilis, Bacillus polymexia & Streotococcus faecalis, gram negative bacteria such as Pseudomonas aerugenosa, Salmonella typhii, Shigella dysenteriae & Escherichia coli and fungi like Penicillum notatum, Aspergillus niger & Candida albicans. The in-vitro antimicrobial activity, minimum inhibitory concentration (MIC) of ethanolic extract was performed by broth dilution method and the zone of inhibition was studied by agar disc diffusion method at concentrations of 2, 5 and 10mg/ml in DMSO. Ciprofloxacin (5µg/ml) and Cotrimazole (25µg/ml) were used as reference control for the antibacterial and antifungal studies respectively. The results of MIC study revealed the antimicrobial activity of the extract against the tested strains of microorganisms between concentration range of 50 and 400 µg/ml. The results of zone of inhibition study revealed concentration dependant nature of the extract with better effectiveness against gram-positive bacteria than gram-negative bacteria. The present study indicates the potential usefulness of Alternanthera sessilis Linn. aerial parts in the treatment of various pathogenic diseases as mentioned in the ayurvedic literature

    Is locking compression plate the best modality of treatment for distal femur fractures?

    Get PDF
    Background: This observational study was conducted in order to study the functional efficacy of locking compression plate in distal femur fractures as they are one of the most common type of fractures with bimodal age distribution affecting younger age group as a consequence of high energy trauma especially road traffic accidents and elderly population due to osteoporosis.Methods: 40 Patients who are skeletally matured with acute distal femur fractures were radiologically assessed type of fractures, amount of comminution, articular congruence and quality of bone. pretested proforma which include age, sex, occupation, mode of injury, type of fracture, time interval between injury and surgery, associated comorbid conditions and other associated injuries.Results: Off the 40 patients under study 21 showed excellent outcome according to neers rating system and only 5 had fair results, 3 patients had superficial wound infection and 5 developed knee stiffness.Conclusions: Locking compression plate produces better results and appears to be good method of management in distal femur fractures

    Fly Ash Particle Reinforced And Mechanical Properties Of AL6061 Graphite B4C Composites

    Get PDF
    Fly ash particle reinforced with aluminium alloy composite materials used for various industrial applications like automobile, aerospace, aircrafts, substrate in electronics, turbine blades, brake pads, golf clubs and it is also used in home products. Metal matrix composites (MMCs) are increased mechanical properties like strength, yield strength, hardness, impact strength and to improve fracture toughness when compared to unreinforced alloys. The main aim is to fabrication of Al6061/Fly ash, Boron carbide, Graphite, and also Magnesium metal matrix composite by using stir casting process and also study the mechanical properties of the fabricated composite material. Fly ashes with aluminium, composite materials are good mechanical and physical properties for very high temperature, resistant to wear and lowest weight applications. Aluminium composite preparing from liquid phase reaction present a unique microstructure. The each phase is a continuous network penetrated by the network of the other constituent. It is an increased composites containing lowest cost expensive and lowest density reinforcements. The fly is very less expensive and very low density reinforced in solid waste by the product during combustion of coal in thermal power plants. Hence, fly ashes with aluminium composites reinforcement are to overcome the cost expensive for wide applications in automotive ancillaries, aircrafts, turbine blades and also engine applications. In future we add the graphite, boron carbide and magnesium with Al6061 & Fly ash to produce other metal matrix composites.Keywords- Fly ash; Wear resistant; Metal–matrix composites (MMCs); Casting; Particle-reinforcement
    corecore