Mobilität und Arbeitsplatz: Erwerbspendler/innen in Tirol

aus dem Inhaltsverzeichnis: Zusammenfassung; Einleitung; Kontextanalyse; Datenbeschreibung und Definitionen; Quantitativer Überblick; Fokussierte Analysen der Pendler/innen; Arbeitsmarktbezogene Cluster in Tirol; Abkürzungsverzeichnis; Glossar; Literaturverzeichnis; Anhang

Evaluierung: Berufskundliche Hauptschulkurse für Jugendliche in Tirol ; Studie im Auftrag des beschäftigungspakt tirol

aus dem Inhaltsverzeichnis: Einleitung; Rahmenbedingungen, Problemsituation und -ausmaß; Qualitative Analyse; Quantitative Analyse; Überlegungen zur Effizienz der Maßnahme; Zusammenfassung und Schlussfolgerung; Literatur; Anhang: Tabellen und Abbildungen

Modelling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

International audienceModeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions thierry le gouguec 1 , najib mahdi 1 , ste ' phane cadiou 1 , ce ' dric quendo 1 , erich schlaffer 2 , walter pessl 2 and alain lefevre 3 The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and often essential. However, a via is not an ideal transmission line. Besides, it creates discontinuities at high frequencies leading to high insertion loss degradation of signal which limits the performances of integrated circuit and systems. In this paper, the impacts of coupling between via and parallel-plates cavity on the response of microwave integrated devices are highlighted in the first part. Then, to describe the intrinsic interaction between the via transition and parallel-plate modes, the notion of parallel-plates matrix impedances is presented and new boundary conditions like open or plated through holes shielded boundaries of the cavities are introduced. Then, using this physics-based model, an intuitive equivalent circuit has been developed. Finally, the proposed approach and the equivalent circuits were validated by using comparisons with electromagnetic simulations and measurements in different scenarios. Three-dimensional (3D) multi-layer technologies such as low temperature co-fired ceramics (LTCC) [1] or high-density multi-layers printed circuit board (HD-PCB) [2] are currently being strongly developed because they offer considerable size reduction as well as the embedded function possibilities. For microwave applications such as filters, couplers, diplexers, etc. [3, 4], these 3D structures offer new design possibilities for frequencies up to 100 GHz. HD-PCB structures consist of several metal layers separated by dielectric substrates. The vias and microvias used in multilayer PCBs allow connecting lines of different metallic levels together or connecting devices to the power and ground plane [5]. The different metal planes can also be connected together with metallic plated through holes (PTHs). With the rise of working frequencies, the stacked multilayer PCB structures are subjected to electromagnetic phenomena like standing waves in cavities or like coupling and interaction between neighboring components. As example of HD-PCB technology, the AT&S TM (PCB manufacturer) technology used during MIDIMU-HD project funded by the Euripides council is presented in Fig. 1. This HD multilayer consists of eight metallic layers (30 mm thickness) separated by Megtron6 (Panasonic TM) sub-strate of 95 mm thickness (depending on the metal densities of each level) and with a relative permittivity 1 r ¼ 3.3 and loss tangent tan(d) ¼ 0.0065 at 40 GHz. A single microvia hole consists of a central cylinder with a diameter of 140 mm, a conductor pad with a diameter of 240 mm, and when this via passes through a metallic plane it will also have a clearance hole called anti-pad of diameter of 350 mm. AT&S is able to stack more than three microvias and to realize buried via with diameter of 200 mm. The PTHs connecting the metal level M1 to the metal level M8 are 200 mm of diameter. Obviously, these multilayer structures which involve parallel planes, dielectric layers, pads, and anti-pads are not ideal transmission components at high frequencies. The electrical behavior of a microvia can be modeled by serial inductance and resistance like is done for a metallic wire [6, 7]. The vias and microvias may cause mismatch [7], crosstalk, reflections, some additional signal delays, and consequently the degradation of signal performance. On the other hand, the coupling between vias, microvias, and parallel plates also plays an important role in the electrical performances of the via transition [8, 9]. The excitation of the parallel plate modes results in conversion of energy between propagation on line and propagation on guided plated structures which imply some transmission zeros

Glacial Geology and Geomorphology of the Sortehjorne Area, East Greenland

Reports studies in 1959 and 1961 of glacial features in five valleys of this area (approx. 72 N, 24 W) near Mesters Vig. Moraines, erratics, striae, kame terraces, emerged marine deltas, and glacial control of drainage patterns are described. Evidence from these features indicates that: during maximum glaciation, the ice margin extended considerably beyond the present coastline; the higher peaks were nunataks; deglaciation was primarily by lateral thinning and downwasting; the sea was at least 75 meters above its present level; a minor readvance of the glaciers occurred in recent time; and the isostatic adjustment of the land caused rejuvenation of the streams, with extensive canyon cutting

Glacial and Postglacial Stratigraphy Along Nash Stream, Northern New Hampshire

Guidebook for field trips in the Rangeley Lakes - Dead River Basin region, western Maine: 62nd annual meeting October 2, 3, and 4, 1970: Trip

Two-Till Problem in Naugatuck-Torrington Area, Western Connecticut

Guidebook for field trips in Connecticut: New England Intercollegiate Geological Conference 60th annual meeting, Yale University, New Haven, Connecticut, October 25-27, 1968: Trip B-

Analyzing the Shuffling Side-Channel Countermeasure for Lattice-Based Signatures

Implementation security for lattice-based cryptography is still a vastly unexplored field. At CHES 2016, the very first side-channel attack on a lattice-based signature scheme was presented. Later, shuffling was proposed as an inexpensive means to protect the Gaussian sampling component against such attacks. However, the concrete effectiveness of this countermeasure has never been evaluated. We change that by presenting an in-depth analysis of the shuffling countermeasure. Our analysis consists of two main parts. First, we perform a side-channel attack on a Gaussian sampler implementation. We combine templates with a recovery of data-dependent branches, which are inherent to samplers. We show that an adversary can realistically recover some samples with very high confidence. Second, we present a new attack against the shuffling countermeasure in context of Gaussian sampling and lattice-based signatures. We do not attack the shuffling algorithm as such, but exploit differing distributions of certain variables. We give a broad analysis of our attack by considering multiple modeled SCA adversaries. We show that a simple version of shuffling is not an effective countermeasure. With our attack, a profiled SCA adversary can recover the key by observing only 7000 signatures. A second version of this countermeasure, which uses Gaussian convolution in conjunction with shuffling twice, can increase side-channel security and the number of required signatures significantly. Here, roughly 285000 observations are needed for a successful attack. Yet, this number is still practical

More Practical Single-Trace Attacks on the Number Theoretic Transform

Single-trace side-channel attacks are a considerable threat to implementations of classic public-key schemes. For lattice-based cryptography, however, this class of attacks is much less understood, and only a small number of previous works show attacks. Primas et al., for instance, present a single-trace attack on the Number Theoretic Transform (NTT), which is at the heart of many efficient lattice-based schemes. They, however, attack a variable-time implementation and also require a rather powerful side-channel adversary capable of creating close to a million multivariate templates. Thus, it was an open question if such an attack can be made practical while also targeting state-of-the-art constant-time implementations. In this paper, we answer this question positively. First, we introduce several improvements to the usage of belief propagation, which underlies the attack. And second, we change the target to encryption instead of decryption; this limits attacks to the recovery of the transmitted symmetric key, but in turn, increases attack performance. All this then allows successful attacks even when switching to univariate Hamming-weight templates. We evaluate the performance and noise resistance of our attack using simulations, but also target a real device. Concretely, we successfully attack an assembly-optimized constant-time Kyber implementation running on an ARM Cortex M4 microcontroller while requiring the construction of only 213 templates