LASOP/MST. Teilvorhaben: Laser-Messsystem Abschlussbericht

Ultrasonic bonding is one of the key technologies for the semiconductor industry. The level to which the process is understood determines how well the reliability and yield of the end product can be optimised. Ideal bond results can only be obtained when the diverse material and process control parameters are perfectly tuned to one another. One particularly important parameter is the ultrasonic energy during the different phases of the bond process. For this reason, the bonding industry is very interesed in finding an active bond process control system to optimise the bond performance. As part of a government funded multidisciplinary project, a sensor has been developed to allow measurement of the ultrasonic amplitude at the tip of the bonding tool. A laser interferometer has been designed with a fiber coupled miniature measurement head which can be mounted on the rotating bond head. A modulated visible diode laser is employed to generate a direction-sensitive Doppler signal according to the pseudo-heterodyne principle. (orig.)SIGLEAvailable from TIB Hannover: DtF QN1(83,24) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman

Flip Chip Technik fuer die Mikrosystemtechnik - Flip Chip. Polymer Flip Chip Technik (PFC"T"M). Leitklebstoffe und Underfiller Abschlussbericht

SIGLEAvailable from TIB Hannover: DtF QN1(68,16) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Micro System Analyzer: Application at UCL

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Entwicklung eines mikroprozessorgestuetzten Kontroll- und Signalverarbeitungssystems fuer Laser 2 Fokus Velocimeter (L2F)

SIGLEDEGerman