CORE
CO
nnecting
RE
positories
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Research partnership
About
About
About us
Our mission
Team
Blog
FAQs
Contact us
Community governance
Governance
Advisory Board
Board of supporters
Research network
Innovations
Our research
Labs
Filters
1 research outputs found
A four-level-metal fully planarized interconnect technology for dense high performance logic and SRAM applications
Author
R.M. Geffken
R.R. Uttecht
Publication venue
Institute of Electrical and Electronics Engineers (IEEE)
Publication date
Field of study
No full text
Crossref
No full text
