379 research outputs found

    opportunities and challenges

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    Funding Information: The work has been supported by the European Union\u2019s Horizon 2020 research and innovation program under the Projects EMERGE, ASCENT+ and INFRACHIP. The INFRACHIP project has received funding under grant agreement no. 101131822. Publisher Copyright: © The Author(s) 2024.A new technological approach is needed for the development of emerging electronic components and systems within the Internet of Things (IoT) era. New advancements and innovations are required in architectural design and hybrid systems heterogeneous integration to address the challenge of widespread IoT deployment, its power demands and sustainability. Hybrid chips are one of the emerging technologies that can help overcome the current limitations in terms of energy consumption, performance and sustainability that could shape the future of electronic systems for targeted applications. Hybrid chips combine different materials and manufacturing technologies on the same substrate or package using advanced flexible heterogeneous integration techniques, with the focus of merging the advantages of each unit or technology toward enhanced performance and new levels of emerging functionalities. The categorization of hybrid chips spans across rigid hybrid chips that follow a multi-chiplet approach, semi-flexible chips that integrate flexible units with semi-rigid ones such as thinned silicon integrated circuits, and lastly, flexible chips in which all components are inherently flexible. This perspective article analyzes technical challenges that arise concerning the development of sustainable materials and processing technologies, complex heterogeneous integration, as well as advanced packaging architectures, standardization, and reliability testing. The economic implications for the semiconductor technology transition to hybrid chips is presented in terms of manufacturing costs, economic feasibility, and market readiness. Key insights and future application opportunities are provided, while recent advancements in the field are summarized. This perspective article suggests that by addressing these challenges, hybrid chips have the potential to transform electronic components and systems across a wide range of industries and use case scenario. The advancement of hybrid chip technologies by enhancing the collaboration between industry and academia as well as policymakers will be a crucial part in the realization of required sustainability goals within the worldwide Chips Act initiative, while ensuring the technological progress has the right balance between improved performance and sustainability.publishersversionepub_ahead_of_prin

    Enzymatic and mRNA Transcript Response of Ovine 6-Phosphogluconate Dehydrogenase (6PGD) in Respect to Different Milk Yield

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    Ovine 6-phosphogluconate dehydrogenase (6PGD) is an enzyme of the pentose phosphate pathway, providing the necessary compounds of NADPH for the synthesis of fatty acids. Much of research has been conducted both on enzymatic level and on molecular level. However, to our knowledge, any correlation between enzymatic activity and 6PGD gene expression pattern related to different physiological stages has not been yet reported. With this report, we tried to highlight if any correlation between enzymatic activity and expression of ovine 6PGD gene exists, in respect to different milk yield. According to the determined enzymatic activities and adipocytes characteristics, ewes with low milk production possessed a greater (P ≤ .001) 6PGD activity and larger adipocytes than the highly productive ewes. Although 6PGD expression pattern was higher in low milk yield ewes than in ewes with high milk production, this difference was not found statistically significant. Thus, 6PGD gene expression pattern was not followed by so rapid and great/sizeable changes as it was observed for its respective enzymatic activity, suggesting that other mechanisms such as post translation regulation may be involved in the regulation of the respective gene

    Engineered spatial inversion symmetry breaking in an oxide heterostructure built from isosymmetric room-temperature magnetically ordered components

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    The oxide heterostructure [(YFeO3)5(LaFeO3)5]40, which is magnetically ordered and piezoelectric at room temperature, has been constructed from two weak ferromagnetic AFeO3 perovskites with different A cations using RHEED-monitored pulsed laser deposition. The polarisation arises through the removal of inversion centres present within the individual AFeO3 components. This symmetry reduction is a result of combining ordering on the A site, imposed by the periodicity of the grown structure, with appropriate orientations of the octahedral tilting characteristic of the perovskite units themselves, according to simple symmetry-controlled rules. The polarisation is robust against A site interdiffusion between the two layers which produces a sinusoidally modulated occupancy that retains the coupling of translational and point symmetries required to produce a polar structure. Magnetization and magneto-optical Kerr rotation measurements show that the heterostructure's magnetic structure is similar to that of the individual components. Evidence of the polarity was obtained from second harmonic generation and piezoelectric force microscopy measurements. Modeling of the piezoresponse allows extraction of d33 (approximately 10 pC N�1) of the heterostructure, which is in agreement with DFT calculations
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