Empyema necessitans and a persistent air leak associated with rupture of an anaerobic lung abscess due to bacteroides

No abstract available

All fiber polarization insensitive detection for spectrometer based optical coherence tomography using optical switch

Polarization dependent image artifacts are common in optical coherence tomography imaging. Polarization insensitive detection scheme for swept source based optical coherence tomography systems is well established but is yet to be demonstrated for all fiber spectrometer-based Fourier domain optical coherence tomography systems. In this work, we present an all fiber polarization insensitive detection scheme for spectrometer based optical coherence tomography systems. Images from chicken breast muscle tissue were acquired to demonstrate the effectiveness of this scheme for the conventional Fourier domain optical coherence tomography system

Groundwater research and management: integrating science into management decisions. Proceedings of IWMI-ITP-NIH International Workshop on "Creating Synergy Between Groundwater Research and Management in South and Southeast Asia," Roorkee, India, 8-9 February 2005

Groundwater management / Governance / Groundwater development / Artificial recharge / Water quality / Aquifers / Groundwater irrigation / Water balance / Simulation models / Watershed management / Water harvesting / Decision making / South East Asia / Bangladesh / China / India / Nepal / Pakistan / Syria

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

An apparatus is disclosed which includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a dc magnetron sputtering system. A gas inlet introduces various gases to the vacuum chamber and creates various gas plasma during the sputtering steps. The rotating turntables insure that the respective wafers are present under the sputtering guns for an average amount of time such that consistency in sputtering and deposition is achieved. By continuous and sequential processing of the wafers in a common vacuum chamber without removal, the adverse affects of exposure to atmospheric conditions are eliminated providing higher quality circuit contacts and functional device

Fast Implementation of Transmit Beamforming for Colocated MIMO Radar

Multiple-input Multiple-output (MIMO) radars benefit from spatial and waveform diversities to improve the performance potential. Phased array radars transmit scaled versions of a single waveform thereby limiting the transmit degrees of freedom to one. However MIMO radars transmit diverse waveforms from different transmit array elements thereby increasing the degrees of freedom to form flexible transmit beampatterns. The transmit beampattern of a colocated MIMO radar depends on the zero-lag correlation matrix of different transmit waveforms. Many solutions have been developed for designing the signal correlation matrix to achieve a desired transmit beampattern based on optimization algorithms in the literature. In this paper, a fast algorithm for designing the correlation matrix of the transmit waveforms is developed that allows the next generation radars to form flexible beampatterns in real-time. An efficient method for sidelobe control with negligible increase in mainlobe width is also presented

The Human Development Index Adjusted for Efficient Resource Utilization

human development index, data envelopment analysis, efficiency, congestion and scale economics

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

The processing of wafer devices to form multilevel interconnects for microelectronic circuits is described. The method is directed to performing the sequential steps of etching the via, removing the photo resist pattern, back sputtering the entire wafer surface and depositing the next layer of interconnect material under common vacuum conditions without exposure to atmospheric conditions. Apparatus for performing the method includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a DC magnetron sputtering system. A gas inlet is provided in the chamber for the introduction of various gases to the vacuum chamber and the creation of various gas plasma during the sputtering steps