Quantitative imaging of concentrated suspensions under flow

We review recent advances in imaging the flow of concentrated suspensions, focussing on the use of confocal microscopy to obtain time-resolved information on the single-particle level in these systems. After motivating the need for quantitative (confocal) imaging in suspension rheology, we briefly describe the particles, sample environments, microscopy tools and analysis algorithms needed to perform this kind of experiments. The second part of the review focusses on microscopic aspects of the flow of concentrated model hard-sphere-like suspensions, and the relation to non-linear rheological phenomena such as yielding, shear localization, wall slip and shear-induced ordering. Both Brownian and non-Brownian systems will be described. We show how quantitative imaging can improve our understanding of the connection between microscopic dynamics and bulk flow.Comment: Review on imaging hard-sphere suspensions, incl summary of methodology. Submitted for special volume 'High Solid Dispersions' ed. M. Cloitre, Vol. xx of 'Advances and Polymer Science' (Springer, Berlin, 2009); 22 pages, 16 fig

A Preliminary Study of the Ma\u3csup\u3ec\u3c/sup\u3eamadot Institution and the Terms ma\u3csup\u3ec\u3c/sup\u3eamad and ma\u3csup\u3ec\u3c/sup\u3eamadot in the Rabbinic Tradition

This study examines the macamadot, the first public worship institution in local communities as described in rabbinic literature. I systematically examine every instance of the terms macamad/ot in the rabbinic sources and then explore the macamadot in context of comparative religious practices in antiquity. Scholars identified the macamadot as the forerunner of the synagogue and the first form of local daily public worship. Whereas up to now the macamadot were understood as dependent on the Temple cult, this study demonstrates that the rabbinic texts, tannaitic and amoraic, define the local daily recital of the creation story from a Torah scroll to be the vital ritual of the institution

Physical, Electrical, and Reliability Considerations for Copper BEOL Layout Design Rules

The continuous scaling needed for better performance and higher density has introduced some new challenges to the back end of line (BEOL) in terms of layout and design. Reductions in metal line width, spacing, and thickness require major changes in both process and design environments. Advanced deep-submicron layout design rules (DRs) should now consider many new proximity effects and reliability concerns due to high electrical fields and currents, planarization-related coverage effects, etc. It is, therefore, necessary to redefine many of the common DRs. For example, space rules now have a complex definition, including both line width and parallel length. In addition, new rules have been introduced to represent the challenges of reliability such as stress-induced voids, time-dependent dielectric breakdowns of intermetal dielectrics, dependency on misalignment, sensitivity to double patterning, etc. This review describes a set of copper (Cu) BEOL layout design rules, as used in technologies featuring lengths ranging from 0.15 μm to 20 nm. The verification of layout rules and sensitivity issues related to them are presented. Reliability-related aspects of some rules, like space, width, and via density, are also discussed with additional design-for-manufacturing layout recommendations

Coverage Layout Design Rules and Insertion Utilities for CMP-Related Processes

The continuous scaling needed for higher density and better performance has introduced some new challenges to the planarity processes. This has resulted in new definitions of the layout coverage rules developed by the foundry and provided to the designers. In advanced technologies, the set of rules considers both the global and the local coverage of the front-end-of line (FEOL) dielectric layers, to the back-end-of-line (BEOL) Cu layers and Al layers, to support high-k/Metal Gate process integration. For advance technologies, a new set of rules for dummy feature insertion was developed by the integrated circuit (IC) manufacturers in order to fulfill coverage limits. New models and utilities for fill insertion were developed, taking into consideration the design coverage, thermal effects, sensitive signal line, critical analog and RF devices like inductors, and double patterning requirements, among others. To minimize proximity effects, cell insertion was also introduced. This review is based on published data from leading IC manufacturers with a careful integration of new experimental data accumulated by the authors. We aim to present a typical foundry perspective. The review provides a detailed description of the chemical mechanical polishing (CMP) process and the coverage dependency, followed by a comprehensive description of coverage rules needed for dielectric, poly, and Cu layers used in advanced technologies. Coverage rules verification data are then presented. RF-related aspects of some rules, like the size and the distance of dummy features from inductors, are discussed with additional design-for-manufacturing layout recommendations as developed by the industry.</jats:p

Coverage Layout Design Rules and Insertion Utilities for CMP-Related Processes

The continuous scaling needed for higher density and better performance has introduced some new challenges to the planarity processes. This has resulted in new definitions of the layout coverage rules developed by the foundry and provided to the designers. In advanced technologies, the set of rules considers both the global and the local coverage of the front-end-of line (FEOL) dielectric layers, to the back-end-of-line (BEOL) Cu layers and Al layers, to support high-k/Metal Gate process integration. For advance technologies, a new set of rules for dummy feature insertion was developed by the integrated circuit (IC) manufacturers in order to fulfill coverage limits. New models and utilities for fill insertion were developed, taking into consideration the design coverage, thermal effects, sensitive signal line, critical analog and RF devices like inductors, and double patterning requirements, among others. To minimize proximity effects, cell insertion was also introduced. This review is based on published data from leading IC manufacturers with a careful integration of new experimental data accumulated by the authors. We aim to present a typical foundry perspective. The review provides a detailed description of the chemical mechanical polishing (CMP) process and the coverage dependency, followed by a comprehensive description of coverage rules needed for dielectric, poly, and Cu layers used in advanced technologies. Coverage rules verification data are then presented. RF-related aspects of some rules, like the size and the distance of dummy features from inductors, are discussed with additional design-for-manufacturing layout recommendations as developed by the industry

Producción y calidad en tres híbridos de maíz forrajero (Zea mays L.) bajo pivote central (LEPA)

"En las regiones áridas y semiáridas el principal factor limitante de la producción es el agua, Cuatrociénegas Coahuila no es la excepción. En esta área se ha hecho una sobre explotación del acuífero debido al inadecuado uso de agua en el sector agrícola, incrementando los costos de extracción, abatimiento y degradación del mismo. El presente trabajo se realizó con el propósito de obtener un manejo más eficiente en el uso de agua de riego en el cultivo de maíz forrajero mediante el sistema de riego con pivote central y su variante (LEPA). El presente trabajo experimental fue desarrollado durante el ciclo agrícola verano del 2006 dentro del Rancho Beta San Gabriel ubicado en el ejido Tanque Nuevo municipio de Cuatrociénegas Coahuila. La siembra se realizó en tres fechas, dado que los tratamientos se establecieron en tres diferentes pivotes centrales que cuentan con variante (LEPA). Además para tener una mejor retención del agua aplicada se construyeron corrugaciones de 75 centímetros de separación y se estableció una población de 93 000 plantas ha-1. Los híbridos utilizados fueron Oso, 3025 W y DK 2020. El primer riego se realizó una vez efectuada la siembra en seco, los riegos posteriores se realizaron por medio de las lecturas de la estación meteorológica ubicada en el mismo rancho, por medio de la evapotranspiración (ETo) donde se aplicó el riego diariamente. La fertilización se realizó aplicando una dosis de 220-80-00, en las conexiones directas del pivote central equipado con una bomba de inyección de pistón y un recipiente de 2500 litros. El diseño experimental utilizado fue bloque completamente al azar con cuatro repeticiones. En los resultados de distribución de materia seca, rendimiento de forraje verde, seco y calidad del forraje, se observó que híbrido el DK 2020 fue superior a los otros dos híbrido, mientras que la mejor eficiencia en uso de agua la presento el Híbrido 3025 W. La calidad del forraje en los tres híbridos de maíz forrajero fue similar y de buena calidad nutricional