64 research outputs found

    Simulation of very-low energy alkali ion (≤ 10 KeV) induced effects on Al2O3 micro flakes

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    A study of clinical profile of patients with cardiomyopathy

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    Kundaini Awakening, the Physical and Psychological Aspects

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    Kundaini is otherwise own as   serpent power lying coiled in the mooladhara chakra at the base of the spine. The ultimate yogic achievement Samadhi can’t be attained unless Kundaini is awakened. Awakening of kundaini requires a rigorous hathayogic practice .Traditional gurus have given the ways and means for practice of Kundaini. Modern scientists, psychologists and medical practitioners have also probed into the study of this mysterious yogic power and revealed a lot in form of different models and theories. By studying in depth the science, technique and effects of the practice, one can have a better understanding of this energy. Different physical and psychological aspects associated with Kundaini energy are discussed in this article from research point of view.</jats:p

    Medical image of the week: infective endocarditis in an IV drug user

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    Study of clinical profile of thyroid functions in patients of type 2 diabetes mellitus

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    Effect of Cooling Medium on Microstructure, Impact and Hardness Properties of Al–15Sn Alloy

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    Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

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    In the present work, the effect of surface texture on wetting characteristics of lead-free solder Sn-0.7Cu on copper substrates have been investigated at 298°C. The wetting tests were carried out using FTA 200 (First Ten Angstrom) dynamic contact angle analyzer. The surface texture of copper substrate significantly affected the wetting properties of Sn-0.7Cu solder alloy. Contact angles of about 30° were obtained on Cu substrate having smooth surface texture (Ra = 0.0155µm). On other hand contact angles on rough copper surface texture (Ra = 1.1194µm) were reduced to 20°. The contact angles decreased with increasing surface texture of Cu substrate. For rough Cu substrate, it seems that the solder atoms dissolve into the substrate in the time period of 200-600s.</jats:p
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